386x Filetype PPT File size 2.67 MB Source: indico.cern.ch
The Semiconductor Roadmap
The SIA (Semiconductor Industry Association) roadmap projects a continuing
miniaturization of silicon semiconductor devices for the next 15 years.
International Technology Roadmap for Semiconductors (ITRS): public.itrs.net
www.iso.gmu.edu
J.R.Krenn – Nanotechnology – CERN 2003 – Part 2 page 2
Moore's Law
Gordon Moore, co-founder of Intel, 1965
www.physics.udel.edu
dot.che.gatech.edu
Hg arc lamp =436, 365, 248 nm, KrF laser =248 nm, ArF laser =193 nm, F laser =157 nm
0 0 0 2 0
J.R.Krenn – Nanotechnology – CERN 2003 – Part 2 page 3
Future Lithography Systems
Prcatically all materials absorb strongly between =157 and 14 nm
Extreme UV laser based plasma sources =10-14 nm, mirrors,
reflection masks
X-ray X-ray tube, synchrotron ~1 nm, Fresnel lenses
Ion projection, (Focused Ion Beam)
Synchrotron radiation based lithography
Lawrence Berkeley National Laboratory (2002) oemagazine.com
EUV lithography unit
J.R.Krenn – Nanotechnology – CERN 2003 – Part 2 page 4
Electronic Elements: Challenges
www.unine.ch
•
scaling rules
•
gate dielectric silicon-dioxide ~ 1.5 nm
=> high-k materials as Al O , TiO ,...
2 3 2
•
dopant fluctuations, noise
•
thermodynamics
•
quantum effects: discretization and tunneling
•
logic circuit architecture
www-hpc.jpl.nasa.gov
J.R.Krenn – Nanotechnology – CERN 2003 – Part 2 page 5
Possible Future Directions
Advanced MOSFET concepts
3D architecture
Superconducting electronics
Single electron devices from [3]
Spintronics
Quantum computing: qubits
DNA computing
J.R.Krenn – Nanotechnology – CERN 2003 – Part 2 page 6
no reviews yet
Please Login to review.