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picture1_Ppt Chemical 66925 | Nack U3 Maeder Vapor Deposition


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File: Ppt Chemical 66925 | Nack U3 Maeder Vapor Deposition
outline plasma deposition introduction deposition coverage the six basic steps of chemical vapor deposition film growth issues concerning pecvd deposition types of pecvd deposition www nano4me org 2018 the pennsylvania ...

icon picture PPTX Filetype Power Point PPTX | Posted on 28 Aug 2022 | 3 years ago
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                                                                              Outline
            • Plasma Deposition Introduction
            • Deposition Coverage
            • The Six Basic Steps of Chemical Vapor 
                   Deposition
            • Film Growth
            • Issues Concerning PECVD Deposition
            • Types of PECVD Deposition
  www.nano4me.org                                                           © 2018 The Pennsylvania State University                                  Physical and Chemical Vapor Deposition 2
               Plasma Deposition Introduction
              • Plasma processing can be used to:
                       –Deposit material (PECVD)
                       –Remove material (etching, ashing, etc.)
                       –Modify the surface through bombardment
                       –Chemically modify the surface
              • These scenarios are complex chemical 
                     processes
              • Generally these consequences occur during any 
                     planned process, but the recipes are designed 
                     to have one result dominate
  www.nano4me.org                                                           © 2018 The Pennsylvania State University                                  Physical and Chemical Vapor Deposition 3
                       Plasma Enhanced Chemical 
                                                    Vapor Deposition
            • The deposition of films using plasma offers 
                   the unique combination of low temperature 
                   and good film composition and coverage
            • Some PECVD systems have the ability to 
                   etch and clean the substrate prior to 
                   deposition, reducing contamination 
  www.nano4me.org                                                           © 2018 The Pennsylvania State University                                  Physical and Chemical Vapor Deposition 4
               Plasma Deposition Introduction
            • RF power is used to break up gas molecules in a 
                   vacuum
            • Molecular fragments (radicals) readily bond to 
                   other atoms to form a film at the substrate’s 
                   surface
            • Gaseous by-products are removed by the 
                   vacuum pumping system
            • The substrate may be heated to increase 
                   surface reactions and drive out contaminants 
  www.nano4me.org                                                           © 2018 The Pennsylvania State University                                  Physical and Chemical Vapor Deposition 5
                                                                              Outline
            • Plasma Deposition Introduction
            • Deposition Coverage
            • The Six Basic Steps of Chemical Vapor 
                   Deposition
            • Film Growth
            • Issues Concerning PECVD Deposition
            • Types of PECVD Deposition
  www.nano4me.org                                                           © 2018 The Pennsylvania State University                                  Physical and Chemical Vapor Deposition 6
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...Outline plasma deposition introduction coverage the six basic steps of chemical vapor film growth issues concerning pecvd types www nanome org pennsylvania state university physical and processing can be used to deposit material remove etching ashing etc modify surface through bombardment chemically these scenarios are complex processes generally consequences occur during any planned process but recipes designed have one result dominate enhanced films using offers unique combination low temperature good composition some systems ability etch clean substrate prior reducing contamination rf power is break up gas molecules in a vacuum molecular fragments radicals readily bond other atoms form at s gaseous by products removed pumping system may heated increase reactions drive out contaminants...

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